diamond wire saw

diamond wire saw also called Ultra fine wire is high carbon,cold drawing of brass plated of high strength steel wire,it can be used for cutting high hardness of monocrystalline silicon, polycrystalline silicon and quartz material etc.

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diamond wire saw overview

diamond wire is high carbon steel wire,aslo called cutting wire or sawing wire. It's cold drawing of brass plated of high strength steel wire,can be used for cutting high hardness of monocrystalline silicon, polycrystalline silicon and quartz material etc.

Henan Hengxing Science&Technology Co.,Ltd can provide all kinds of all kinds of the length of the wire, the line length subject only to the spool take-up capacity limit. H wheel type mainly includes NTC210 type, BS200, BS64, BS126, etc. According to customer needs to provide other specification size h wheel.

advantages of diamond wire cutting

The diamond wire multi-wire slicing technology has the advantages that it is with quick speed, high machining precision, low cutting loss, high efficiency, energy saving, environment-friendly. The cutting speed of diamond wire is 3 times that of traditional slurry cutting.

It makes a revolutionary contribution to the energy conservation and cost-reducing of PV and sapphire cutting industry.

Storage requirements and matters needing attention

1. Each tray are desiccant

2. Tray vacuum packing open before, in the temperature and humidity appropriate warehouse environment can deposit 6 months

3. In the tray vacuum packing open before, please first will be placed on the tray use environment, in order to avoid temperature lead to water vapor condensation

4. Please do not bare hand touch just silk

5. In the open h wheel package preparation in the machine welding/tie wire tension when you end rubber ring, avoid to cause threading or loose ends

6. In transit please don't stack tray

Packaging and Delivery

Packaging:steel spool, carton, wooden pallet

The cargo is shipped by sea in full containers

Technical Parameters

Product Code(um)	Diameter(um)	core wire Diameter(um)	Diamond particleSize(um)	Min Circle diameter(mm)	Min Breaking Load（N）	Particles(/mm)	Application
50	65±2	50	5-10	100	Min.9.5	150-300	Single crystal cutting
52	67±3	52	5-10	100	Min.10	150-300	Single crystal cutting
55	70±3	55	5-10	100	10	150-300	polycrystalline Silicon Slicing cutting
57	72±3	57	6-12	100	13	150-350
60	75±3	60	6-12	100	13.5	150-350
65	80±3	65	6-12/7-14	100	15.2	150-350
70	85±3	70	7-14	100	17.2	150-350
80	95±3	80	6-12/8-12	100	20.5	150-350
145	145±10	120	8-12/8-16	130	40	Min.30	MagneticMaterial Cutting
180	185±10	125	30-40	130	49	Min.30
195	195±10	130	30-40	130	50	Min.30
210	210±10	150	23-35/30-40	130	60	Min.30
230	230±10	160	30-40	130	70	Min.30	Sapphire Cutting
240	240±10	170	30-40	130	78	Min.30
250	255±10	180	30-40	150	80	Min.30
260	260±10	180	30-40/35-45	150	83	Min.30
320	320±10	250	40-50	150	150	Min.30	Silicon Bricking and Cropping
350	350±10	300	40-50	150	200	Min.30
370	385±10	300	30-40/40-50	200	200	Min.30
420	420±10	350	40-50	200	280	Min.30	Silicon Bricking/Squaring
450	450±10	350	45-55	200	280	Min.30	Silicon Bricking/Squaring